Part Number Hot Search : 
47N60CFD AMIS30 SPLSI BCR8PM D2412 PS20S10 407T26BM R1002
Product Description
Full Text Search
 

To Download SBRS8130LT3G Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  ? semiconductor components industries, llc, 2012 january, 2012 ? rev. 9 1 publication order number: mbrs130lt3/d mbrs130lt3g, SBRS8130LT3G schottky power rectifier surface mount power package this device employs the schottky barrier principle in a large area metal ? to ? silicon power diode. state ? of ? the ? art geometry features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. features ? very low forward voltage drop (0.395 volts max @ 1.0 a, t j = 25 ? c) ? small compact surface mountable package with j ? bend leads ? highly stable oxide passivated junction ? guard ? ring for stress protection ? esd ratings: ? human body model = 3b (> 16000 v) ? machine model = c (> 400 v) ? aec ? q101 qualified and ppap capable ? sbrs8 prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb ? free* mechanical characteristics ? case: epoxy, molded ? weight: 100 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 ? c max. for 10 seconds ? cathode polarity band *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. http://onsemi.com smb case 403a schottky barrier rectifier 1.0 ampere 30 volts device package shipping ? ordering information mbrs130lt3g smb (pb ? free) 2,500 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. marking diagram 1bl3 = specific device code a = assembly location y = year ww = work week  = pb ? free package ayww 1bl3   (note: microdot may be in either location) SBRS8130LT3G smb (pb ? free) 2,500 / tape & reel
mbrs130lt3g, SBRS8130LT3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current t l = 120 ? c t l = 110 ? c i f(av) 1.0 2.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 40 a operating junction temperature t j ? 65 to +125 ? c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead  jl 12 ? c/w thermal resistance, junction ? to ? ambient (t a = 25 ? c, min pad, 1 oz copper) junction ? to ? ambient (t a = 25 ? c, 1? pad, 1 oz copper) r  ja 228.8 71.3 ? c/w electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 1) (i f = 1.0 a, t j = 25 ? c) (i f = 2.0 a, t j = 25 ? c) v f 0.395 0.445 v maximum instantaneous reverse current (note 1) (rated dc voltage, t j = 25 ? c) (rated dc voltage, t j = 100 ? c) i r 1.0 10 ma 1. pulse test: pulse width = 300  s, duty cycle ? 2%. v f , instantaneous voltage (v) figure 1. typical forward voltage figure 2. maximum forward voltage 0.1 1 10 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 i f , instantaneous forward current (a) t j = 100 ? c 25 ? c 0.1 1 10 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 i f , maximum instantaneous forward current (a) t j = 100 ? c 25 ? c v f , maximum instantaneous voltage (v)
mbrs130lt3g, SBRS8130LT3G http://onsemi.com 3 100 10 1.0 0.1 0.01 0.001 0 3 6 9 12 15 18 21 24 27 30 v r , reverse voltage (v) i r , ireverse current (ma) t j = 100 ? c 25 ? c 0 3 6 9 12 15 18 21 24 27 30 v r , reverse voltage (v) i r , ireverse current (ma) t j = 100 ? c 25 ? c figure 3. typical reverse leakage current figure 4. typical maximum reverse leakage curent 100 10 1.0 0.1 0.01 0.001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 100 105 110 115 120 125 130 t c , case temperature ( ? c) figure 5. current derating (case) i f(av) , average forward current (a) square wave dc 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 i f(av) , average forward current (a) figure 6. typical power dissipation p f(av) , average power dissipation (w) square dc c, capacitance (pf) 400 350 300 250 200 150 100 50 0 0 4 8 12162024 2832 v r , reverse voltage (volts) figure 7. typical capacitance note: typical capacitance at 0 v = 290 pf
mbrs130lt3g, SBRS8130LT3G http://onsemi.com 4 figure 8. thermal response, min pad t, time (s) 1 1000 0.1 0.2 0.02 d = 0.5 0.05 0.01 single pulse 100 1000 10 0.1 0.001 0.0001 0.000001 0.1 100 10 1 0.01 0.00001 effective transient thermal resistance figure 9. thermal response, 1 inch pad t, time (s) 1 0.1 0.2 0.02 d = 0.5 0.05 0.01 single pulse 100 1000 10 0.1 0.001 0.0001 0.000001 0.1 100 10 1 0.01 0.00001 effective transient thermal resistance figure 10. thermal resistance vs. copper area figure 11. power dissipation vs. copper area 0 25 50 75 100 125 150 175 200 225 0 100 200 300 400 500 600 700 copper area (mm 2 )  ja ( ? c/w) 2.0 oz 1.0 oz 250 275 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 100 200 300 400 500 600 700 copper area (mm 2 ) power dissipation (w) 2.0 oz 1.0 oz 2.0 power based on t a = 25 ? c
mbrs130lt3g, SBRS8130LT3G http://onsemi.com 5 package dimensions smb case 403a ? 03 issue h e b d c l1 l a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. d dimension shall be measured within dimension p. 2.261 0.089 2.743 0.108 2.159 0.085  mm inches  scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* dim a min nom max min millimeters 1.90 2.20 2.28 0.075 inches a1 0.05 0.10 0.19 0.002 b 1.96 2.03 2.20 0.077 c 0.15 0.23 0.31 0.006 d 3.30 3.56 3.95 0.130 e 4.06 4.32 4.60 0.160 l 0.76 1.02 1.60 0.030 0.087 0.090 0.004 0.007 0.080 0.087 0.009 0.012 0.140 0.156 0.170 0.181 0.040 0.063 nom max 5.21 5.44 5.60 0.205 0.214 0.220 h e 0.51 ref 0.020 ref d l1 h e polarity indicator optional as needed on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbrs130lt3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative


▲Up To Search▲   

 
Price & Availability of SBRS8130LT3G

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X